Standard Process
Multilayer Niobium Process
Reliable Josephson-junction nodes with high uniformity, low defect density and robust cryogenic stability.
SUPERCONDUCTING DIGITAL CIRCUITS
From design support and MPW or dedicated-wafer fabrication to 3D integration and millikelvin characterization, our end-to-end capabilities enable scalable cryogenic digital-control chips for quantum computing.
FULL-STACK SERVICE
Standard Process
Reliable Josephson-junction nodes with high uniformity, low defect density and robust cryogenic stability.
Custom Engineering
Full-wafer runs for proprietary materials, specialized layer stacks and large-die architectures.
DC · RF · High-speed
Automated DC parameters plus millikelvin RF and high-speed functional characterization.
MCM Integration
Dense, low-latency interconnect between SFQ controllers and superconducting qubit arrays.
CRYOGENIC INTEGRATION
Through MCM bonding engineered for deep-cryogenic environments, low-power superconducting digital control units are co-located with qubits in the same cryogenic stage, dramatically reducing control and readout signal fan-out while shortening signal paths and minimizing latency.
APPLICATIONS
CONTROL · READOUT
On-chip control, readout drivers and low-noise TWPA / JPA superconducting devices.
RSFQ · ERSFQ
Ultra-high-speed, low-power digital architectures based on RSFQ and ERSFQ.
RF · SNSPD
Wideband mixed RF/digital processing with monolithic SNSPD integration.
BUILD WITH US