FOUNDRY & CO-DEVELOPMENT

A Reliable Fabrication and Collaboration Platform for Quantum-Chip Innovation

Built on mature quantum-chip process baselines and advanced vertical-integration technologies, our platform accelerates customer designs from proof of concept to high-quality devices while working with partners to build an integrated ecosystem for the future of quantum computing.

Close-up of superconducting quantum chip fabrication equipment

TWO WAYS TO WORK TOGETHER

From reliable fabrication to building new capabilities together

BASELINE PROCESS

A process platform spanning devices, wiring, integration and materials

BASELINE PROCESS
01

QUBITS

Qubits

  • Shadow evaporation
  • Overlap Josephson junction process
  • Josephson junction array process
  • Ultra-compact Josephson junction arrays
02

CONTROL / WIRING

Control / Wiring

  • High-Q resonators
  • Partially covered grounded airbridges
  • Fully covered grounded airbridges
  • Superconducting metal bumps
  • Normal-metal bumps
03

VERTICAL INTEGRATION

Vertical Integration

  • High aspect-ratio TSV
  • Double-sided patterns
  • Superconducting UBM
  • Chip-to-chip bonding
04

MATERIAL STACK

Material Stack

  • Tantalum / niobium / aluminum
  • Titanium nitride / niobium nitride
  • Noble normal-metal materials
  • High kinetic-inductance materials
  • Insulating dielectric materials

FROM LAYOUT TO CAPABILITY

A clear technical deliverable at every step

01Design review
02Process definition
03Fabrication
04Device delivery

BUILD WITH US

Turn your next quantum hardware iteration into a deliverable result

Start a process review ↗